Advanced Photonics Inc. , a company specialized in semiconductors, optical communications and optical interconnection

  • Api was established on the ba sis of the long years of research on semiconductors, optical communications and optical interconnection conducted by a group headed by Mr.Yoshiaki Nakano in his research lab. at the University of Tokyo Research Center for Advanced Science and Technology.
  • Api has its sights firmly fixed on the activities in the global market and creates highly competitive products which may be regarded as global standard.
  • Api infinitely pursues potential of photonics and creates new value, thereby contributing to development of society and mankind.
  • Api manages its organization in a manner where incentives for its employees are harmonized with the company’s growth and profitability, and returns satisfactory profits to its shareholders.
    • api_news more information

    2011/6/1～3
    JPCA show 2011We will have an exhibit at the “JPCA show 2011” at which we will be presenting our latest products. This will take place in June over three days (1st to the 3rd) in the Tokyo International Exhibition Center better known as the Tokyo Big Sight and is sponsored by the Japan Electronics Packaging and Circuits Association.
    http://www.jpcashow.com/show2011/English/

    2011/4/13～15
    Photonix2011We have been accepted to present at “Photonix2011” which will be held on the 13th to 15th of April 2011 at the Big Site Tokyo, we will be exhibiting our products.
    http://www.photonix-expo.jp/photonix/en/

    2010/08/16
    Reported on the front page of the Nikkei Business Daily Newspaper
    "300 Gigabit inter LSI chip communication, even through curved interconnects"
    For further details, click here(PDF File)

    2010/7/7～9
    Technology Fair in Kawasaki 2010We will have an exhibit at the “Technology Fair in Kawasaki 2010” at which we will be presenting our latest products. This will take place in July over three days (7th to the 9th) in the Kanagawa Science Park (KSP) Innovation Centre and is sponsored by the Kanagawa Industrial Promotion Center.
    http://www.tech-kawasaki.jp/ttk2010/

    2010/6/18
    We will be giving a presentation at the Agilent Symposium Series 2010 which will be held on the 17th and 18th of June. The title of the talk will be “(Mixing electronics and optics) the development of mixed PCB’s using ecological and open innovation techniques”. This symposium will take place at the Hachioji offices of Agilent Technologies in Japan and our talk will be on the 18th of June.
    http://www.agilent.co.jp/find/sympo

    2010/6/2～4
    JPCA show 2010We will have an exhibit at the “JPCA show 2010” at which we will be presenting our latest products. This will take place in June over three days (2nd to the 4th) in the Tokyo International Exhibition Center better known as the Tokyo Big Sight and is sponsored by the Japan Electronics Packaging and Circuits Association.
    http://www.jpcashow.com/show2010/English/index.html

    2010/01/20～22
    foe2010We have been accepted to present at “FOE2010” At this show, “The Fiber Optics Exposition 2010”, which will be held on the 20th to 22nd of January 2010 at the Big Site Tokyo, we will be exhibiting our products.
    http://www.foe.jp/foe/

    At the aforementioned show we shall also be giving a talk in the related expert skills seminar, which takes place during the exhibition. The title of our talk is “Open innovation strategy for the introduction of optical interconnects into PCB boards.
    Date: Friday 22nd of January 2010 at 9:30-12:00   Session: FOE-11
    http://www.foe.jp/jp/conference10/foe.phtml#FOE11

    2009/12/10～12
    smfgWe have been accepted to present at the “SMFG Environment-Related Business Forum” At this show, “SMFG Environment-Related Business Forum held within Eco-Products 2009”, which will be held on the 10th to 12nd of December 2009 at the Big Site Tokyo, we will be exhibiting our products.
    http://eco-pro.com/eco2009/

    2009/8/7
    Inclusion in the “First ‘monotsukuri’ skilled manufacture product development business support of 2009 This is a program to support and aid businesses in the issues of manufacturing and selling of products and is overseen by the National Federation of Small Business Associations here in Japan.
    http://www.chuokai.or.jp/josei/info_m_090807s.html

    api_media more information

    Electronic Packaging Technology2009/10
    In the October 2009 Japanese journal Electronic Packaging Technology release we released an article entitled “The development of light interconnect PCB substrate technology to facilitate a light testing system”
    The translation of this publication is given here (pdf file)